암페놀센싱코리아
핵심역량
암페놀센싱코리아는 6인치 양산 FAB을 통하여
매년 1억 5천만개의 MEMS 및 MGS소자(온도·습도·압력 ·적외선 ·가스)를
다양한 고객사에 공급하고 있습니다.
매년 1억 5천만개의 MEMS 및 MGS소자(온도·습도·압력 ·적외선 ·가스)를
다양한 고객사에 공급하고 있습니다.
FAB Introduction
- MEMS Products manufacturing capacity for High volume (150MMdies/year)
- High level clean room : Class 10 to 100
- IATF-16949 Automotive Quality Proven and ISO14001 Certified
- MEMS Production and Engineering capabilities over 25 years
Equipment Capacity
-
Various & Stable thin film deposition
- Wide range from 0.01um to 10.00um
- and High temp. Silicon nitride & oxide
- Metal: Ti, Al, Cr, Pt, Au, AuSn, Cu
-
MEMS Specialized Photolithography
- Spin & Spray photoresist coating on 3D structure
- High DOF Stepper for MEMS devices
- 0.5um Resolution and Both side alignment
-
Dry Etching for Extensive Materials
- Etching materials:SiNx, SiOx, Poly-Si, Al, Pt, Ti
- DRIE can etch Silicon to 600um vertically
-
Precise Wet Etching Control
- Silicon bulk etching & micro-machining
- Electrical Silicon etch control: Tx target +/-0.5um
- Various Acid & Organic wet bench
-
Full Automation Die Fab Process
- Dicing, Auto-probing & Auto-vision system
개발 및 생산 능력
MEMS · MSG 소자 디자인부터 제품 양산화까지 암페놀센싱코리아에서 가능합니다.
MEMS 활용 제품
IR Sensors
Basic Principle
Themopile Type Infra-Red Detector
Thin Film Diaphragm (0.5~3.0um)
Cavity by Dry & Wet Process
Markets
Healthcare & Safety
Automotive
Temp Control
Energy Save
Pressure Sensors
Basic Principle
Piezo-resistive Type by Wheatstone bridge
Process & Product Capabilities
Diaphragm Control
Absolute & Gauge Type Pressure Device
- Membrane : Silicon
- Thickness Range : 5um~150um
- Control Capability : +/-0.5um
Si Fusion Bond
Anodic Bond
Triple Bonding
Markets
Mobile Navigation
MedicalBlood pressure
Automotive
Various MEMS Products
Silicon Micro-machining Products
Bulk & Surface Micro-machining
Silicon Surmount for Optical Devices
- Metallization and Solder(AuSn)on 3D Structures
- Silicon and Al Nitride Substrate
Thin Film Control Products
Polymer Capacitance Type on Silicon & Glass
